Ottiku Notebook BGA Xogħol mill-ġdid Stazzjon

1. Prodott Introduzzjoni

A immexxi mill-kamera allinjament sistema jipprovdi mingħajr żball eżattezza minn pre-allinjament għal komponent tqegħid.

Preċiżjoni Hot Arja Teknoloġija tiżgura il meħtieġa temperatura hija milħuqa mingħajr il-komponent 27s specs (tolleranza ta ' +/- 1%)

Magħmul for all SMD rework challenges. For reliable, good-as-new reworked components.

Għaxar Times imtejjeb Teħid ta 'Kampjuni Preċiżjoni Temperatura Kontroll

Built-in high-power, high-response heaters

2. Prodott Speċifikazzjonijiet

3.Prodott Applikazzjonijiet

Użat ħafna in in chip level tiswija in li ġej prodotti:
1. Laptop & desktop PCBA
2. Game console, such as Xbox one, Play Station 4 motherboards
3. Mobile phone PCBA, such as iPhone motherboards
4. TV&TV Set-top box motherboard
5. Server, Printer, Camera etc motherboard

Can rework BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.

4. Prodott dettalji

5.Prodott Kwalifiki

6. Servizzi tagħna

1. We are the Manufacturer=own factory+ machine design+Sheet metal produced by ourselves +spray the powder

      + Strong Assemble The Machine Team + Packaging+free training;
2. Logo/Brand: Customer's designs and logos are welcome, we can silk-print your own logo;
3. HUAWEI, SAMSUNG, TCL, ZTE, MEIZU, KONKA, LENOVO, FOXCONN vendor;
4. Have good markets in Korea, Japan, NorthAfrica, Vietnam, Brazil, Turkey, India, Mexico and South Asia, The Mid-East 

    u European countries;
5. 100% NEW minn Dinghua fabbrika

7. FAQ 

Spezzjoni ta ' BGA istann joint

BGA spezzjoni huwa wieħed ta ' l- l-aktar iebsa impjiegi. It isir estremament diffiċli biex tispezzjona il - BGA ġonot peress il l-istann is 

underneath the BGA Package and is not visible. The only satisfactory means of testing BGA Solder Joints is X-rays. X-Ray

 Helps to See the joints UnderNeath the package and Thus Help Helps in The Inspection.